MADISON, Wisc. — Spansion is rising a new microcontroller designed to offer high-performance tellurian appurtenance interface (HMI) for vehicle dashboards and clusters. The new microcontroller is a latest member of Spansion’s Traveo automotive MCU family.
The new MCU facilities Spansion’s HyperBus memory interface. The disdainful interface, grown to offer low latency, high review throughput and low pin-count, can accommodate such final as “instant-on” and an “interactive graphical user interface” better, according to Spansion.
More important, a new automotive MCU integrates a 2D or 3D graphics engine (or both) directly into a MCU. That creates a new microcontroller “the initial 3D-capable ARM Cortex-R5 formed MCU,” according to a company.
The idea is to move high-end graphics capabilities — so distant disdainful to oppulance cars — into “everyday cars,” pronounced Saied Tehrani, comparison clamp boss of Spansion’s MCU Business Group.
With Spansion’s new MCU designed for HMI in place, automobile OEMs will no longer need to supplement an outmost graphics engine to make their clusters demeanour better, he explained. The new 3D-capable MCU is a ideal resolution for OEMs who crave softened graphics though don’t indispensably wish to compensate for it.
The graphics cores used inside a MCU came to Spansion when it bought Fujitsu’s MCU business final year. The graphics IPs — now jointly owned by Spansion and Fujitsu — can beget “all a worldly 2D and 3D graphics” demanded by carmakers, pronounced Tehrani.
Of course, a graphics opening won’t be a same as carrying a dedicated high-end graphics chip, like that of NVidia that was creatively designed for gaming.
But Spansion’s new MCU offers graphics facilities “tailored for automotive applications,” pronounced Tehrani. They embody quick digest of 2D and 3D effects, matrix sketch and even “warping on a fly.” Warping is quite critical for head-up displays, that need images to be corrected immediately when projected on a winding front potion of a car. More automobile OEMs are formulation to supplement head-up arrangement in newer models.
Where Spansion’s 3D-capable MCU shines, in particular, are in a reduced memory footprint and softened memory access. Once a 3D graphics engine is integrated in a MCU, there will be no need for outmost DRAM. This leads to altogether cost reduction. Tier 1s or OEMs can also opt for usually a 2D graphics engine in a MCU. The choice creates Spansion’s solutions scalable — both in cost and graphics performance, creation them easier to compare carmakers’ budgets for opposite models.
Tier 1s and carmakers cite to use a same platform, pronounced Tehran, opposite their automobile models. “It creates it easier to support all of their cars — since they can use an MCU from a same family, a same software, a same play and components.”
The new MCU also incorporates endless multimedia support with “a cutting-edge” sound system, according to Spansion. Asked because a cluster complement needs sound, Tehrani explained that carmakers mostly adopt a same MCU used for clusters in core consoles for infotainment systems. “High-end core stacks opt for a opposite SoC, though mid-tiers are some-more prone to use a same MCU,” he added.
Spansion’s new MCU also supports a operation of communication protocols. They embody CAN-FD (CAN with stretchable data-rate), Ethernet AVB, and modernized graphics interfaces such as LVDS PHY and RSDS.
While there is no eccentric marketplace information available, Spansion estimates that a association has roughly a 40% tellurian share of MCUs used for lurch and clusters.
Spansion is sampling a new MCU now. The association expects it to be designed into 2016 cars that automobile OEMs will deliver in 2015.
Spansion has been bustling beefing adult a Traveo family MCU portfolio. Earlier this year, it launched MCUs designed for foundation (EVs and hybrids), followed by a rollout in May of MCUs designed for physique electronics. The association announced this week a MCUs for HMI in dashboards and clusters as a latest further of a Traveo family.
— Junko Yoshida, Chief International Correspondent, EE Times
Article source: http://www.eetimes.com/document.asp?doc_id=1324158